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(FC)TSOT (Flip Chip) Thin Small Outline Transistor Package Type Lead Count (FC)TSOT 5/6/8 Leadframe Material C194 Die Attach Conductive Epoxy - 84-1 LMI-SR4 / 8290 Wire Size 20 / 25 / 30 / 33um gold wire Mold Compound Sumitomo G600 Series (Green) Marking Top / Bottom - Laser Lead Finish Pure Tin
Anst offers standard TSOT23 packages for the manufacturers of discrete devices, passives, and low lead count IC devices.
Some of these packages are also available in flip chip configurations.
Availability
Bill of Material
Non-conductive Epoxy - 84-3J / QMI538NB
20 / 30 / 42um copper wire
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