晶圆分拣机和处理解决方案

OAI自动化系统提供各种晶片处理解决方案。 系统可以配置为50mm（2“）的化合物半导体晶片高达300mm的硅晶片。人机工程学操作界面和Windows NT平台允许轻松设置工艺配方模块化结构与高可靠性，低维护设计，从而提高设备生产率。

OAI，超洁净机器人处理机在世界一流的洁净室环境中运行，可配置为与300mm FOUP晶片传输系统连接。 在另一个极端，我们专门处理易碎的GaAs和InP晶片。 我们为您的特定需求提供定制的自动化解决方案：晶圆装载和卸载，分拣，转移，OCR读取，装箱和检查。

Wafer Sorters and Handling Solutions

OAI Automation Systems offer a wide range of wafer handling solutions. Systems can be configured for 50mm (2") compound semiconductor wafers up to 300mm silicon wafers. The ergonomic operator interface and Windows NT platform allow easy set-up of process recipes. Modular construction is coupled with a high-reliability, low maintenance design, leading to improved equipment productivity.

OAI, ultra-clean robotic handlers operate in world-class clean room environments and can be configured to interface with 300mm FOUP wafer transport systems. At the other extreme, we specialize in handling fragile GaAs and InP wafers. We offer customized automation solutions for your specific needs: wafer loading & unloading, sorting, transferring, OCR reading, binning and inspection.