设备特点：

This is the single wafer Cleaning M/C of the dip type. it is possible correspondence to 300mm

・ This machine is a dip style single wafer model one by one processing machine and set the work uplight to vertical in loader and do each processing with the robot.After the final rinse ended the work , do return spin drying horizontally by the reversal system.

・ Production possibility by the kind of chemical.

・ Possibility that correspond to the various kinds etching system . Because the robot speed is a high speed(500mm/sec). 

・ Because it is a single wafer model etching is uniformly

・ Display of excellent washing ability to resist stripping system.