微孔陶瓷工作盘是各种半导体片生产过程中用于吸附及承载的专用工 具，应用于减薄、划片、清洗、搬运等工序。我公司生产的工作盘可以和日本、 德国、以色列、美国及国产的设备配套使用，具有优越的性能价格比。 Fine-pore ceramic chuck tables are mainly used to support and chuck the semico
nductor wafer when grinding and dicing. It is applied in the processes of thinning, dicing, cleaning, transportation and so on. These products which have high cost performance produced by our institute can match with the machines made in Japan, Germany, Israel, America and China.
加工对象：2、3、4、5、6、8、12 英寸半导体片 配套机床：减薄机、划片机、清洗机等 吸盘类型：微孔陶瓷 Workpiece processed: 2,3,4,5,6,8,12 inches semiconductor wafer Suitable devices: Wafer grinder, dicing machine and cleaning machine ,etc Chuck type: Fine-pore ceramic
主要特点： 平面度、平行度高 / 组织致密均匀，强度高、通透 性好，吸附力均匀 / 易于修整 Main features High flatness and parallelism/Compact and uniform microstructure with high strength/Good permeability and uniform adsorption affinity / Dressing easily
