光绘菲林-PCB、IC干版
详情介绍
主要应用领域：
主要用于PCB、IC载板及IC Lead frame等行业
Applications：
The product is mainly used in PCB,IC substrate and IC substrate and IC Lead frame,etc.
精度指标 Specifications (Standard Size:430mmx430mm)
| 最小线宽/线缝Min.Line/Space Width | 20μm/20μm |
| 线条精度CD Control | ±2.0μm |
| 总长精度Total Pitch Accuracy | ±5.0μm |
| 图形位置精度Registration Accuracy | ±4.0μm |
| 套合精度Overlay Accuracy | 4.0μm |
| 垂直精度Orthogonality | 4.0μrad |
干版材料 Substrate
| 材料 Material | Soda Lime Glass |
| 最大尺寸Max. Size | 24"×32" |
| 常规尺寸Normal Size | 5"x5",20"x24",22"x26",24"x28" |
| 厚度 Thickness | 5.0mm±0.2mm |
| 药膜 Film Type | Emulsion |
| 光学密度Optical Density(λ=450nm) | ≥3.6 |